The Chip Architect
India Chip Pvt Ltd is a 60:40 joint venture between HCL Group and Foxconn.
Roshni Nadar Malhotra, Chairperson, HCL Group
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In Jewar’s industrial sprawl, a new joint venture between HCL and Foxconn is quietly scripting India’s semiconductor story. As India aims to come into the top countries globally that make chips, powering the latest equipment, the HCL–Foxconn Outsourced Semiconductor Assembly Test (OSAT) facility in Gautam Buddha Nagar, is a step towards self-reliance in the chip supply chain.
India Chip Pvt Ltd is a 60:40 joint venture between HCL Group and Foxconn. The advanced OSAT is expected to be operational by 2028 and will make display driver chips (DDICs). The company has earmarked an investment of INR 3,700 crore over the next few years in the state-of-the-art facility.
At the helm of this initiative is Roshni Nadar Malhotra, chairperson, HCL Group. She is bullish about the chip ecosystem in India and takes pride in pioneering DDICs, “This is the first facility to make these chips. Not only domestic demands, we will cater to exports as well. We are aligned with Make In India, and this is a step towards reducing dependence on imports for DDICs,” she said.
Almost 70 per cent of the produced chips from the facility will meet domestic demands and 30 per cent will be for exports. DDICs are currently imported into India, with the segment being almost entirely dependent on imports as of early 2026. These chips are crucial for devices such as smartphones, laptops, televisions, and automobile displays.
With a planned capacity to process 20,000 wafers per month, the facility will play a pivotal role in meeting India’s growing domestic demand for semiconductor components while strengthening a resilient, self-reliant semiconductor supply chain.
Roshni Nadar Malhotra has a vision to create an end to end value chain in DDICS, when asked about having a fab for the same, she said, “Right now, we are focused on OSAT. The equipment and wafers are imported as not all parts of the supply chain can be sourced locally. But as and when opportunity arises, we will localize.”
This milestone is especially significant as HCL, a global technology powerhouse with an expanding base of users for its worldclass software platforms, celebrates its 50th anniversary. “This project marks a significant new chapter in the HCL Group’s growth story and builds on our strong engineering legacy, which has long contributed to India’s technology and manufacturing ecosystem,” she said.
As display technology evolves over time, DDIC functionality has become increasingly complex. At such a juncture, this OSAT facility will be a step towards India’s engineering precision.
In Jewar’s industrial sprawl, a new joint venture between HCL and Foxconn is quietly scripting India’s semiconductor story. As India aims to come into the top countries globally that make chips, powering the latest equipment, the HCL–Foxconn Outsourced Semiconductor Assembly Test (OSAT) facility in Gautam Buddha Nagar, is a step towards self-reliance in the chip supply chain.
India Chip Pvt Ltd is a 60:40 joint venture between HCL Group and Foxconn. The advanced OSAT is expected to be operational by 2028 and will make display driver chips (DDICs). The company has earmarked an investment of INR 3,700 crore over the next few years in the state-of-the-art facility.
At the helm of this initiative is Roshni Nadar Malhotra, chairperson, HCL Group. She is bullish about the chip ecosystem in India and takes pride in pioneering DDICs, “This is the first facility to make these chips. Not only domestic demands, we will cater to exports as well. We are aligned with Make In India, and this is a step towards reducing dependence on imports for DDICs,” she said.
